Kingston Technology Introduces First High-Performance Low-Latency DDR2 Notebook Memory for Global Market
DDR2-667 Memory Ready to Enhance Current Laptops with No Overclocking Required
Hsinchu, Taiwan – April 21, 2008 –
Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is first to offer high performance, low-latency DDR2-667 SO-DIMM notebook memory to the world. Offering greater performance options for existing mobile platforms, the HyperX DDR2-667 CL4 SO-DIMM kits in 2GB and 4GB capacities are the first in a new line of memory innovations Kingston plans to release over the next few months to the notebook market.
“Kingston customers asked about higher performance memory for current notebooks and our new DDR2-667 CL4 low-latency SO-DIMMs are the first in a series of new HyperX memory offerings to support this market,” said Ann Bai, Product Manager, DRAM Memory, APAC Region, Kingston. “We will continue to expand the product line, including developing a 3GB memory kit.”
The new HyperX DDR2-667 CL4 high performance mobile memory is a perfect fit for notebook users who want to boost system performance by replacing their standard notebook memory with high-performance modules that boot to the highest speed possible ― without any need to adjust system BIOS settings.
Kingston HyperX 667MHz Low-Latency DDR2 SO-DIMM Specifications |
Part Number |
Capacity and Features |
KHX5300S2LLK2/2G |
2GB 667MHz Low-Latency DDR2 (CL4-4-4-12 @ 1.8v) SO-DIMMs, kit of 2 |
KHX5300S2LLK2/4G |
4GB 667MHz Low-Latency DDR2 (CL4-4-4-12 @ 1.8v) SO-DIMMs, kit of 2 |
Kingston HyperX memory is backed by a lifetime warranty and free technical support. For more detailed information please visit the Kingston Web site at www.kingston.com/asia.
About Kingston Technology Company, Inc.
Kingston and the Kingston logo are registered trademarks of Kingston Technology Corporation. All rights reserved. All other marks may be the property of their respective titleholders.
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