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DDR2 Memory Chips

DDR memory chips are made with the familiar black resin Thin Small Outline Package (TSOP) as well as other chip types. DDR2 memory can no longer be manufactured into TSOP chips, and are only specified to be FBGA (Fine-pitch Ball Grid Array) chips, shown below:

DDR2 Memory Chips - 'package types'

DDR2 chips are also internally different from DDR memory chips. For example, DDR2 memory chips feature:
  • 1.8 Volt operation, delivering about 50% less power usage as well as generating less heat compared to DDR
  • Memory signal termination inside the memory chip ("On-Die Termination") to improve signal quality and integrity (prevents reflected signal transmission errors at high speeds).
  • Operational enhancements to increase memory performance, efficiency, and timing margins
  • DDR2 CAS Latencies: 3, 4, 5, and 6

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