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Kingston - Leading the Way to DDR3

DDR3 Module In 2004, DDR memory technology matured, and the computer industry selected DDR2 to be the next-generation memory technology. DDR2 memory technology is based upon DDR memory technology, with enhancements to enable improved performance in key areas.

In 2007, DDR2 memory technology matured, and the computer industry selected DDR3 to be the next-generation memory technology. DDR3 memory technology is based upon DDR2 memory technology, with enhancements to enable improved performance in key areas to support a new generation of quad-core processors.

Kingston works closely with JEDEC, the industry's standards organization. Kingston has engineers involved in a number of memory design subcommittees, and has a representative on JEDEC's Board of Directors.

Kingston also has engineering-level interfaces with technology companies such as Intel Corporation, global DRAM, chipset, motherboard, and system manufacturers. This industry alliance launched DDR3 memory and platforms in June 2007. Additional system manufacturers are expected to support DDR3 memory as the technology ramps in 2007 and 2008.

Kingston's commitment to JEDEC's processes and technology partnerships ensure that Kingston is always first to market with new memory technologies.

Kingston and its sister company, Advanced Validation Labs, Inc. (AVL) provide DDR3 memory chip and memory module validation services to the industry and provide Intel-certification testing. AVL is the industry's leading memory technology validation lab, with testing services certified by major system manufacturers as well as major chipset manufacturers, including Intel, SiS, VIA, nVIDIA, and ATI.

Agilent 93000 Starting in early 2006, Kingston and AVL engineers set up the DDR3 validation service utilizing Agilent 93000 reference testers and proprietary testing software to check DDR3 memory chips and modules against specifications.

AVL has conducted hundreds of memory technology validations, including DDR3, DDR2, DDR, RDRAM, and PC133. The results of AVL's certification testing can be found on the Intel® memory technology web site.

Kingston invested tens of millions into new manufacturing machines and high-end testers to support DDR3 and DDR2 memory. Kingston has mature manufacturing, testing, and quality assurance processes for producing and testing memory modules with chips in Chip-Scale Packages (CSP). Chip Scale Package is a type of memory chip packaging that includes Fine-Pitch BGA which is used exclusively for DDR3 and DDR2.

Kingston launched DDR3 modules in speeds of 1066MHz in June 2007, followed by 1333MHz. Faster 1600MHz DDR3 memory is expected in late 2008 or 2009.

DDR2 is expected to be the dominant memory technology until late 2009, when DDR3 is expected to start becoming the dominant mainstream memory technology.


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