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Kingston Announces Proprietary Elevated Package Over CSP (EPOC) Technology for Memory Modules
New Patent-Pending Memory Module Design and Manufacturing Technology Delivers On Manufacturability, Reliability And Performance
Fountain Valley, Calif. - (July 22, 2002) - Kingston® Technology Company, Inc. today announced the introduction of a
proprietary, patent-pending, 3-dimensional memory module technology called Elevated Package Over CSP (EPOC™). This newly-developed technology, which
raises the price-performance bar in high-capacity memory modules, will initially be available for high-capacity, 1.2-inch high, registered memory
modules.
"Kingston's EPOC technology is a true win-win for Kingston and its customers," stated David Sun, co-founder and COO, Kingston. "The EPOC memory
modules are an alternative to stacked-chip modules that will enable Kingston to stabilize the memory pricing volatility involved with third-party
chip-stacking and reduce the production delays from weeks to days."
Kingston engineers worked closely with Payton Technology Inc., a Kingston subsidiary dedicated to specialty chip packaging and testing, to develop
this new technology. "This joint Kingston-Payton project demonstrates the benefit of Kingston's Express Wafer-to-Module program, which results in
Kingston's faster response to customer orders without jeopardizing quality or reliability," said Daniel Hsu, general manager, Payton. "Payton's
expertise in specialty memory chip packaging complements Kingston's fast-cycle memory module manufacturing strategy."
The EPOC technology mounts DRAM chips in different packages in two overlapping rows on the printed circuit board. The top tier is a row of raised
Thin-Small Outline Package (TSOP) memory chips, and the lower tier is a row of smaller Chip Scale Package (CSP) memory chips. There are no chip-level
interconnects or physical contact between the two overlapping rows. With the EPOC technology, the two rows of memory chips are not in direct contact,
thereby allowing airflow in-between the top and bottom chip rows for more effective heat dissipation.
"Kingston engineers established three project objectives," explains Dr. Wayne Koh, director, advanced technology, Kingston. "We first set out to
eliminate the long lead-times required to stack memory chips when using third-party stacking companies. Such lead-times impact customer order shipments
and can have significant financial impact when memory prices fluctuate. Kingston engineers also set a design objective requiring the new technology
to be as easy to manufacture as standard modules. Finally, our goal was to enhance thermal performance and overall reliability. The EPOC technology
met all our design goals, resulting in high-capacity DIMM modules with a 1.2 inch high, 1U form factor," added Koh.
About Kingston Technology Company, Inc.
Kingston Technology Company, Inc. is the world's largest independent manufacturer of memory products. Kingston operates manufacturing facilities in
Malaysia, Taiwan, China and Fountain Valley, Calif., including Payton Technology Corp., Kingston's back-end processing facility supporting memory
packaging, test and logistics. With the advent of Payton, Kingston supports all memory processing functions from receipt of wafer to completed module.
Kingston serves a network of distributors, OEMs, and retail customers in more than 3,000 locations worldwide. For more information on Kingston, call
(800) 337-8410, or go to www.kingston.com
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