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Kingston Launches New DDR2 Memory Modules
Next-generation DDR2 Memory Technology Offers Faster Speeds, Greater Bandwidths, Lower Power Consumption and Enhanced Thermal Performance
Fountain Valley, CA - (March 17, 2004), Kingston® Technology
Company, Inc., the independent world leader in memory products, today announced the release of
DDR2 memory modules. Shipping immediately in limited quantities, Kingstonā offers 400- and 533- MHz
DDR2 Registered DIMMs, Unbuffered DIMMs and SODIMMs, in capacities up to 1 GB, to support the
next-generation computer platforms launching in 2004.
"DDR memory technology has matured and reached its limits, and DDR2 is the new technology that has
been chosen by the industry to replace it. DDR2 memory features faster speeds of up to 667 MHz, higher
data bandwidths, lower power consumption by about 50 percent, and enhanced thermal performance
versus DDR," said Mark Tekunoff, senior technology manager, Kingston. "It's a memory innovation that we
expect to see rapidly embraced."
Over the past few years, Kingston has worked closely with JEDEC, the memory standards organization,
and DRAM, system and motherboard manufacturers in developing the new DDR2 memory technology. In
addition, Kingston is a founding member of Intel's "Memory Implementers Forum", a new on-line community
focused on advancing key memory technologies such as DDR2.
DDR2 memory chips will be available in Fine-pitch BGA (FBGA) chip packages for improved electrical and
thermal characteristics. In addition, DDR2 memory chips will incorporate On-Die Termination (ODT) to
minimize memory signal reflections at high speeds, thereby improving timing margins. DDR2 memory chips
will come in capacities up to 4 Gigabits, allowing for higher-capacity modules.
DDR2 modules have differing pin configurations, voltage requirements and DRAM chip technology than DDR.
As a result, DDR2 is not backward-compatible with existing DDR motherboards. To prevent accidental insertion
into an incompatible motherboard, DDR2 modules have a unique key or "notch" in their connector that must
match the memory socket.
DDR2 Features:
- 1.8 Volts operation, reducing power consumption by about 50 percent.
- Memory signal termination inside the memory chip ("On-Die Termination") to prevent reflected signal transmission errors.
- Operational enhancements to increase memory performance, efficiency and timing margins.
- CAS Latencies: 3, 4 and 5
| Kingston DDR2 Memory Products |
| Part Number | Capacity and Features |
| Server Registered 400 MHz DIMMs, 240 Pin, 1.8 V |
| KVR400D2R3/512 | 512 MB 400 MHz registered ECC DDR2 DIMM |
| KVR400D2R3/1G | 1 GB 400 MHz registered ECC DDR2 DIMM |
| |
| Desktop Unbuffered 533 MHz DIMMs, 240 Pin, 1.8 V |
| KVR533D2N4/256 | 256 MB 533 MHz unbuffered DDR2 DIMM |
| KVR533D2N4/512 | 512 MB 533 MHz unbuffered DDR2 DIMM |
| KVR533D2N4/1G | 1 GB 533 MHz unbuffered DDR2 DIMM |
| KVR533D2E4/256 | 256 MB 533 MHz ECC unbuffered DDR2 DIMM |
| KVR533D2E4/512 | 512 MB 533 MHz ECC unbuffered DDR2 DIMM |
| KVR533D2E4/1G | 1 GB 533 MHz ECC unbuffered DDR2 DIMM |
| |
| Portable Unbuffered SODIMMs, 533/400 MHz 200 Pin, 1.8 V |
| KVR533D2S4/256 | 256 MB 533 MHz DDR2 SODIMM |
| KVR533D2S4/512 | 512 MB 533 MHz DDR2 SODIMM |
| KVR400D2S3/256 | 256 MB 400 MHz DDR2 SODIMM |
| KVR400D2S3/512 | 512 MB 400 MHz DDR2 SODIMM |
As DDR2 memory becomes widely adopted during 2004, it will be used to improve performance on desktops,
notebooks, and servers as well as telecommunication and networking devices. DDR2 memory modules in the
future will include all popular memory form factors: Registered DIMMs, Unbuffered DIMMs (ECC/non-ECC)
DIMMs, SO-DIMMs, MicroDIMMs, Mini Registered DIMMs, and custom modules for proprietary products.
For more detailed information on DDR2 technology and Kingston memory products, please visit the Kingston
Technology Web site at http://www.kingston.com
About Kingston Technology Company, Inc.
Kingston Technology Company, Inc. is the world's largest independent manufacturer of memory
products. Kingston operates manufacturing facilities in Malaysia, Taiwan, China and Fountain
Valley, Calif., including Payton Technology Corp., Kingston's back-end processing facility
supporting memory packaging, test and logistics. With the advent of Payton, Kingston
supports all memory processing functions from receipt of wafer to completed module.
Kingston serves a network of distributors, OEMs, and retail customers in more than 3,000
locations worldwide. For more information on Kingston, call (800) 337-8410, or go to
www.kingston.com.
# # #
Editor's Note: For additional information, evaluation units or executive interviews, please contact
Heather Skinner, Kingston Technology Company, Inc. 17600 Newhope Street, Fountain Valley, CA USA 92708, (714) 438-1817
(Voice), (714) 438-2720 (Fax).
Kingston and the Kingston logo are registered trademarks of Kingston Technology Corporation. All rights reserved. All other
marks may be the property of their respective titleholders. *Prices Subject to Change Without Notice.
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