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Kingston Technology Branded Memory |
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BRANDED MEMORY HOME
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Notebook Memory
Portable computers require precision memory solutions for demanding applications, and Kingston Technology is dedicated
to providing the ultimate in memory products for today's powerful notebook computers. As portable PC devices get smaller
in size, space limitations for memory upgrades can become an issue.
Kingston Technology is well positioned to offer the latest in technological advances that help us design and deliver
smaller form-factor modules. We specialize in the engineering of low-profile SODIMMS and MicroDIMMS, using CSP architecture,
Grid ball array and other technologies that enable us to fit a small form factor memory module into a notebook upgrade
socket. Many PC manufacturers have come to us first to help them design memory solutions to work with their new systems
limited space.
Additionally, Kingston Technology sells more notebook upgrade memory than anyone in the world, as we manufacture tens of
thousands of notebook memory modules each day for PC manufacturer's to use as their system memory and as memory upgrades.
Kingston Technology offers you thousands of memory solutions for portables, notebooks, tablet PCs, hand-held PCs and PDAs.
Our memory modules are specifically designed and tested in more than 25 different notebook brands.
Our commitment to the portable computing industry is to take the next step in offering products that go beyond the original
system specifications. Our pledge is to continue to offer products that enable portable PC devices to run at an optimum level.
Notebook Memory Milestones
October 1987
Kingston Technology was the first memory manufacturer to offer lifetime warranties on our memory modules, including modules for notebooks.
October 1996
Toshiba® America Information Systems selected Kingston Technology as the official designer and manufacture of NoteWorthy® memory upgrades
for Toshiba's entire line of notebooks and desktops. The Kingston Technology and Toshiba agreement marked the first formal endorsement of
a memory manufacturer by a major PC company.
February 2000
Kingston Technology was the first memory manufacturer to offer low-profile PCB 256MB PC100 SODIMM for notebook computers. This allowed users
to surpass any current notebook upgrade options by doubling the PC manufacturer's capacity in most cases. Modules supporting
notebooks by Compaq, Dell, IBM and Toshiba.
Kingston Technology is the first to design a 512MB SODIMM memory module for the Apple® PowerBook® G3. Kingston Technology worked in conjunction with Apple
on the development of this module and increased Apple's maximum upgrade capacity from 512MB to 1024MB. Not only was it the first time
that a 512MB module was available for the PowerBook, but marked the first time in history that any notebook reached the 1GB memory
capacity, even greater than Apple's original specs.
April 2001
Kingston Technology is first to offer System Validated SO-RIMM modules.(Rambus)
Kingston Technology is first to design a new low-profile 1.25" 512MB PC133 SO-DIMM supporting the Apple Titanium PowerBook G4, first to bring it
to 1GB. Again working in with Apple directly to maximize the memory capacity of PowerBook G4.
July 2001
Kingston Technology chosen by Viewsonic as the preferred memory upgrade option for their Super PDA, Tablet PC and PDA products.
August 2001
Kingston Technology ships smallest low-profile PC100/133 SO-DIMM memory modules using CSP Technology.
October 2001
Kingston Technology announces DDR PC1600 and DDR 2100 SO-DIMM development modules.
November 2001
Kingston Technology ships PC2100 MicroDIMMs.
March 2002
Kingston Technology Announces DDR SO-DIMM Modules up to 512MB.
April 2002
Kingston Technology Releases 1 and 2GB Low-Profile DDR PC2100 Registered ECC memory modules.
July 2002
Kingston Technology announces proprietary elevated package over CSP (EPOC) technology enabling high capacity, 1.2 inch high registered
memory modules.
August 2002
Kingston Technology releases 1st DDR333 memory supporting new Apple PowerMac G4, supporting up to 2GBs of DDR memory.
March 2003
Kingston Technology offers high capacity monolithic SDRAM for strategic notebook OEMs. The first independent memory manufacturer to offer 1GB
SODIMMs for notebook OEMs as base memory and for customer upgrades. 1GB upgrades are available for PC models made by Apple, Dell,
HP/Compaq, IBM, Sony and Toshiba.
March 2003
Kingston Technology announces 1GB 266MHz PC2100 SODIMM memory modules.
April 2003
Kingston Technology announces validated SODIMM memory modules for Intel Centrino mobile technology platform.
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Notebook Memory Terms
BGA (Ball Grid Array) - A chip package having solder balls on the underside for mounting. BGA allows for a
reduction in die package size, better heat dissipation, and greater module densities.
Chip-Scale Package (CSP) - Thin chip packaging whereby electrical connections are typically through a ball
grid array. Chip-scale packaging is used in RDRAM and flash memory.
DDR (Double Data Rate Memory) - The latest generation of SDRAM technology. Data is read on both the rising
and the falling edge of the computer clock, thereby delivering twice the bandwidth of standard SDRAM. With DDR SDRAM, memory
speed doubles without increasing the clock frequency.
DIMM (Dual In-line Memory Module) - A printed circuit board with gold contacts and memory devices. A DIMM is
similar to a SIMM, but with this primary difference: unlike the metal leads on either side of a SIMM, which are "tied together"
electrically, the leads on either side of a DIMM are electrically independent.
DRAM (Dynamic Random-Access Memory) - The most common form of RAM. DRAM can hold data for only a short time.
To retain data, DRAM must be refreshed periodically. If the cell is not refreshed, the data disappear.
Megabyte (MB) - The most common term used to denote the capacity of a memory module. 1 megabyte equals
approximately one million bytes, or exactly 1 byte x 1,0242 (1,048,576) bytes.
Memory - A computer's random-access memory. Memory temporarily holds data and instructions for the CPU. Also
referred to as memory module. See RAM.
Memory Bank - A logical unit of memory in a computer, the size of which the CPU determines. For example, a
32-bit CPU requires memory banks that provide 32 bits of information at a time. A bank can consist of one or more memory modules.
Micro BGA (µBGA) - Tessera, Inc. BGA chip packaging technique that allows for a reduction in die package size,
improved heat dissipation, and greater module densities.
MicroDIMM (Micro Dual In-Line Memory Module) - Smaller than an SODIMM, MicroDIMMs are primarily used in
sub-notebook computers. MicroDimms are available in 144-pin SDRAM (up to 133MHz from Kingston Technology) and 172-pin DDR (up to 333MHz from
Kingston Technology).
Motherboard - Also known as the logic board, main board, or computer board, the motherboard is the computer's main
board and in most cases holds all CPU, memory, and I/O functions or has expansion slots for them.
RAM (Random-Access Memory) - A memory cell configuration that holds data for processing by a central processing unit
(CPU). Random means the CPU can retrieve data from any address within RAM. Also see Memory.
RIMM™ ( memory Module) - The trademarked name for a Direct Rambus memory module. A RIMM™ conforms to the DIMM form
factor and transfers data 16 bits at a time.
SDRAM (Synchronous DRAM) - A DRAM technology that uses a clock to synchronize signal input and output on a memory chip.
The clock is coordinated with the CPU clock so the timing of the memory chips and the timing of the CPU are in synch. Synchronous DRAM
saves time in executing commands and transmitting data, thereby increasing the overall performance of the computer. SDRAM allows the CPU
to access memory approximately 25 percent faster than EDO memory.
SODIMM (Small-Outline Dual In-line Memory Module) - An enhanced version of a standard DIMM, as they are smaller and
thinner than a DIMM and are used primarily in notebook computers. A 72-pin small-outline DIMM is about half the length of a 72-pin SIMM.
144-pin and 200-pin modules are the most common SODIMMs today.
TSOP (Thin Small-Outline Package) - A DRAM package that uses gull-wing leads on both sides. TSOP DRAM mounts directly on
the surface of the printed circuit board. The TSOP package is one-third the thickness of an SOJ. TSOP components commonly occur in
small-outline DIMMs.
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Testing / Compatability
Testing expertise has become a major differentiator for Kingston Technology - a key capability that has allowed Kingston Technology to become
the world's leading contract manufacturer of memory products to the global semiconductor manufacturers for many years.
Kingston Technology goes above and beyond the normal testing procedures to ensure that the module your receive is the most reliable and compatible
memory module available today. We test 100%. That means that every module is testing in-house before it ships to you. 100% testing means that you
get a proven module the first time, every time. Kingston Technology tests every cell, on every chip, on every module. This is most comprehensive testing in
the industry and ensures that Kingston Technology delivers only proven, compatible and guaranteed solutions.
Design Testing
Kingston Technology puts each new module prototype through a rigorous testing process to insure the reliability, integrity and compatibility of its
design. Each module is manufactured to be 100% compatible with the system or class of systems it is designed for. Each new design is subjected to a
series of reviews and tests. This process includes:
- Specification Test
- Compatibility Test
- Software Benchtop Test
- Signal Quality and Integrity Test
- Reliability Test
- Guardband Test
- ATE Specification Test
- Production Testing
Kingston Technology has always had an unwavering practice of 100% production testing of all finished goods. This means testing every cell on every chip
on every module. On a 128MB module that is 1,024 million cells.
Kingston Technology utilizes several different types of testers in our production testing process. Kingston Technology's testers often utilize Kingston Technology proprietary designed
software and/or hardware. Our proprietary production test software checks for speed, proper addressing and runs a variety of patterns to check for
weaknesses in the memory chip itself. In addition, we can run custom patterns that screen modules for problems specific to certain chips, system boards
or operating environments.
For more information, please visit our testing section of our website.
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