Kingston eMMC™ is an embedded, non-volatile memory system, comprised of both Flash memory and a Flash memory controller, which simplifies the application interface design and frees the host processor from low-level Flash memory management. eMMC is a popular storage component for many consumer electronic devices, including smartphones, tablets and Mobile Internet Devices. It is increasingly adopted in many industrial and embedded applications.
For developers, eMMC simplifies the interface design and qualification process, resulting in a reduction in time to market and facilitates support for future Flash device offerings.
Small BGA package sizes and low power consumption make eMMC a viable, low-cost memory solution for mobile and embedded products. To better meet the requirement of many space constrained wearable and IoT applications, Kingston released world’s smallest eMMC package with standard JEDEC footprint. The technology specifications of eMMC are managed by JEDEC, the global leader in developing open standards for the microelectronics industry.
Kingston’s I-temp eMMC product offers JEDEC eMMC 5.0 features and backward compatibility to previous eMMC standards. It has all of the advantages of standard eMMC and the operating temperature range of the device meets industrial operating temperature requirements (-40°C~85°C), making it an ideal storage solution for harsh outdoor environment and automotive applications.
|Part Number||Capacity||eMMC standard||Package||Description|
|EMMC04G-M627||4GB||5.1 (HS400)||11.5x13x1.0||153b 4GB eMMC|
|EMMC08G-M325||8GB||5.1 (HS400)||11.5x13x1.0||153b 8GB eMMC|
|EMMC16G-M525||16GB||5.1 (HS400)||11.5x13x1.0||153b 16GB eMMC|
|EMMC32G-M525||32GB||5.1 (HS400)||11.5x13x1.0||153b 32GB eMMC|
|EMMC64G-M525||64GB||5.1 (HS400)||11.5x13x1.0||153b 64GB eMMC|
|EMMC128G-M522||128GB||5.0 (HS400)||11.5x13x1.4||153b 128GB eMMC|
|EMMC04G-S627||4GB||5.1 (HS400)||7.6x11.1x1.0||Ultra small 153b 4GB eMMC|
|EMMC08G-S325||8GB||5.1 (HS400)||7.6x11.1x1.0||Ultra small 153b 8GB eMMC|
|EMMC16G-S325||16GB||5.1 (HS400)||7.6x11.1x1.0||Ultra small 153b 16GB eMMC|
|EMMC32G-S325||32GB||5.1 (HS400)||7.6x11.1x1.0||Ultra small 153b 32GB eMMC|
|EMMC04G-W627||4GB||5.1 (HS400)||11.5x13x1.0||I-temp 153b 4GB eMMC|
|EMMC08G-W325||8GB||5.1 (HS400)||11.5x13x1.0||I-temp 153b 8GB eMMC|
|EMMC16G-W525||16GB||5.1 (HS400)||11.5x13x1.0||I-temp 153b 16GB eMMC|
|EMMC32G-W525||32GB||5.1 (HS400)||11.5x13x1.0||I-temp 153b 32GB eMMC|
|EMMC64G-W525||64GB||5.1 (HS400)||11.5x13x1.0||I-temp 153b 64GB eMMC|
For designs that don't have an eMMC footprint laid out yet, these eMMC to SD/MMC adapters let users test eMMC through an SD/MMC slot without changing the PCB layout.
|EMMC04G-M627-ADP||4GB eMMC adapter|
|EMMC08G-M325-ADP||8GB eMMC adapter|
|EMMC16G-M525-ADP||16GB eMMC adapter|
|EMMC32G-M525-ADP||32GB eMMC adapter|
|EMMC64G-M525-ADP||64GB eMMC adapter|
Kingston has the expertise to deliver what you need, when you need it. Our lead time is exceptionally short, way ahead of the industry norm. And we can respond quickly to changing requests.
If your organization has specific requirements, Kingston can accommodate them. Flexible shipment logistics mean we can drop ship to multiple locations and schedule shipping around production requirements.
Each project is tracked and supported, from sample to mass production. A free evaluation sample ships directly from Kingston to the customer, and FAE support is available to answer customers’ technical questions.
Kingston works closely with chipset vendors, distributors and manufacturers around the globe to support customer needs. See partners
Tight BOM control means you get exactly what you want, every time. Part numbers are locked to configuration and firmware. There’s a pre-SMT programming service for your convenience and support for every customer, big or small.
Kingston works with many chipset vendors to test and qualify products and has an in-house lab for internal component testing and compatibility testing on multiple chipset platforms.
ISO/TS16949 certified manufacturing facilities allow for mass production with advanced multi-die stacking packaging technology plus advanced memory testing equipment. Kingston maintains a high standard for quality control and product reliability testing.
Leveraging high volume material purchasing means we can maintain competitive pricing. Look to us for global high-volume, mass production facilities with advanced manufacturing technology and expertise.
With fast production turnaround times and ability to drop ship to multiple locations, Kingston supports customer production requirements and supports design-in specifications for manufacturing and shipping globally.
Live FAE and technical resource support is available during the design-in phase. For troubleshooting, Kingston maintains an in-house lab with multiple chipset platforms available.