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Embedded Solutions

Embedded Products

Kingston offers a variety of embedded memory products, including eMMC and DRAM components, to customers worldwide. These products are ideal for memory and storage for many embedded applications.

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Kingston ePoP is a highly integrated JEDEC standard component that combines eMMC and LPDRAM into one package with a tiny footprint. ePoP is mounted directly on top of a compatible host CPU, which effectively saves board space and ensures optimum performance as a result of the memory’s proximity to the host CPU. It is an ideal solution for highly space-constrained systems such as wearables.

ePoP Part Numbers and Specifications
P/N Capacity Speed Mode e•MMC version Package Size
04EPOP04-NL3DM627 4GB MLC + 4Gb LPDDR3 HS400 5.0 10 x 10 x 1.0 (136 Ball)
04EPOP08-NL3DM627 4GB MLC + 8Gb LPDDR3 HS400 5.0 10 x 10 x 1.0 (136 Ball)
08EPOP04-NL3DT227 8GB TLC + 4Gb LPDDR3 HS400 5.0 10 x 10 x 1.0 (136 Ball)
08EPOP08-NL3DT227 8GB TLC + 8Gb LPDDR3 HS400 5.0 10 x 10 x 1.0 (136 Ball)
What makes Kingston unique?

Kingston has the expertise to deliver what you need, when you need it. Our lead time is exceptionally short, way ahead of the industry norm. And we can respond quickly to changing requests.


If your organization has specific requirements, Kingston can accommodate them. Flexible shipment logistics mean we can drop ship to multiple locations and schedule shipping around production requirements.

Direct support

Each project is tracked and supported, from sample to mass production. A free evaluation sample ships directly from Kingston to the customer, and FAE support is available to answer customers’ technical questions.

Industry alliances

Kingston works closely with chipset vendors, distributors and manufacturers around the globe to support customer needs.  See partners

Exceptional customer support

Tight BOM control means you get exactly what you want, every time. Part numbers are locked to configuration and firmware. There’s a pre-SMT programming service for your convenience and support for every customer, big or small.

Chipset validation

Kingston works with many chipset vendors to test and qualify products and has an in-house lab for internal component testing and compatibility testing on multiple chipset platforms.

Backend packaging technology

ISO/TS16949 certified manufacturing facilities allow for mass production with advanced multi-die stacking packaging technology plus advanced memory testing equipment. Kingston maintains a high standard for quality control and product reliability testing.

High volume

High-volume material purchasing enables us to maintain competitive pricing. Look to us for global high-volume, mass production facilities with advanced manufacturing technology and expertise.

Logistical support

With fast production turnaround times and ability to drop ship to multiple locations, Kingston supports customer production requirements and supports design-in specifications for manufacturing and shipping globally.

Engineering support

Live FAE and technical resource support is available during the design-in phase. For troubleshooting, Kingston maintains an in-house lab with multiple chipset platforms available.

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