ePoP – Embedded Package-on-Package memory for Wearables

ePoP - Embedded Package-on-Package memory for Wearables

Kingston’s ePoP provides a highly integrated JEDEC standard component that combines Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Package-on-Package (PoP) solution. ePoP is mounted directly on top of a compatible host System-on-a-Chip (SoC), which reduces Printed Circuit Board (PCB) space, and ensures optimum performance. ePoP is an ideal solution for space constrained applications such as wearables.

Request Information

ePoP Part Numbers and Specifications

LPDDR3 based ePoP
Part NumberCapacityStandardPackageFBGAOperating
Temperature
NAND
(GB)
DRAM
(Gb)
eMMCDRAM(mm)
04EP04-N3GM627 4 4 5.0 LPDDR3 10x10x0.8 136 -25°C ~ +85°C
04EP08-N3GM627 4 8 5.0 LPDDR3 10x10x0.85 136 -25°C ~ +85°C
08EP08-N3GTC32* 8 8 5.1 LPDDR3 10x10x0.85 136 -25°C ~ +85°C
32EP08-N3GTC32 32 8 5.1 LPDDR3 10x10x0.85 136 -25°C ~ +85°C
LPDDR4x based ePoP
Part NumberCapacityStandardPackageFBGAOperating
Temperature
NAND
(GB)
DRAM
(Gb)
eMMCDRAM(mm)
08EP08-M4ETC32* 8 8 5.1 LPDDR4x 8x9.5x0.8 144 -25°C ~ +85°C
08CP08-M4ETC32* 8 8 5.1 LPDDR4x 8x9.5x0.85 144 -25°C ~ +85°C
16EP08-M4ETC32 16 8 5.1 LPDDR4x 8x9.5x0.8 144 -25°C ~ +85°C
32EP08-M4ETC32 32 8 5.1 LPDDR4x 8x9.5x0.8 144 -25°C ~ +85°C
16EP16-M4FTC32 16 16 5.1 LPDDR4x 8x9.5x0.8 144 -25°C ~ +85°C
32EP16-M4FTC32 32 16 5.1 LPDDR4x 8x9.5x0.8 144 -25°C ~ +85°C
32CP16-M4FTC32 32 16 5.1 LPDDR4x 8x9.5x0.85 144 -25°C ~ +85°C

Related Videos