ePoP Component - Embedded package on package memory for device manufacturers

Kingston ePoP is a highly integrated JEDEC standard component that combines eMMC and LPDRAM into one package with a tiny footprint. ePoP is mounted directly on top of a compatible host CPU, which effectively saves board space, and ensures optimum performance as a result of the memory’s proximity to the host CPU. It is an ideal solution for highly space-constrained systems such as wearables.

ePoP Part Numbers and Specifications

P/NCapacitySpeed Modee•MMC versionPackage Size
04EPOP04-NL3DM627 4GB MLC + 4Gb LPDDR3 HS400 5.0 10 x 10 x 1.0 (136 Ball)
04EPOP08-NL3DM627 4GB MLC + 8Gb LPDDR3 HS400 5.0 10 x 10 x 1.0 (136 Ball)
08EPOP04-NL3DT227 8GB TLC + 4Gb LPDDR3 HS400 5.0 10 x 10 x 1.0 (136 Ball)
08EPOP08-NL3DT227 8GB TLC + 8Gb LPDDR3 HS400 5.0 10 x 10 x 1.0 (136 Ball)