Embedded Solutions

Embedded Products

Kingston offers a variety of embedded memory products, including eMMC and DRAM components, to customers worldwide. These products are ideal for memory and storage for many embedded applications.

Request Information

Kingston MCP

The Kingston MCP component comes with JEDEC standard ballout. It integrates SLC NAND Flash with LPDRAM inside one small footprint package. Its compact size and low power consumption make it an ideal memory solution for many IoT and wearable applications. MCP with Industrial operating temperature range (-40°C~85°C) is also available.

MCP Part Numbers and Specifications
MCP P/Ns SLC NAND Capacity LPDDR2 Capacity Description Package DRAM Speed Operating Temperature
KSLCMBL2BA2M2A 4Gb 2Gb 4Gb x8 SLC NAND + 2Gb x32 LPDDR2 162 ball MCP 8x10.5x1.0 1066 Mbps -25°C~+85°C
KSLCMBL2BA2M2C 4Gb 2Gb I-temp 4Gb x8 SLC NAND + 2Gb x32 LPDDR2 162 ball MCP 8x10.5x1.0 1066 Mbps -40°C~+85°C
What makes Kingston unique?

Kingston has the expertise to deliver what you need, when you need it. Our lead time is exceptionally short, way ahead of the industry norm. And we can respond quickly to changing requests.


If your organization has specific requirements, Kingston can accommodate them. Flexible shipment logistics mean we can drop ship to multiple locations and schedule shipping around production requirements.

Direct support

Each project is tracked and supported, from sample to mass production. A free evaluation sample ships directly from Kingston to the customer, and FAE support is available to answer customers’ technical questions.

Industry alliances

Kingston works closely with chipset vendors, distributors and manufacturers around the globe to support customer needs.  See partners

Exceptional customer support

Tight BOM control means you get exactly what you want, every time. Part numbers are locked to configuration and firmware. There’s a pre-SMT programming service for your convenience and support for every customer, big or small.

Chipset validation

Kingston works with many chipset vendors to test and qualify products and has an in-house lab for internal component testing and compatibility testing on multiple chipset platforms.

Backend packaging technology

ISO/TS16949 certified manufacturing facilities allow for mass production with advanced multi-die stacking packaging technology plus advanced memory testing equipment. Kingston maintains a high standard for quality control and product reliability testing.

High volume

Leveraging high volume material purchasing means we can maintain competitive pricing. Look to us for global high-volume, mass production facilities with advanced manufacturing technology and expertise.

Logistical support

With fast production turnaround times and ability to drop ship to multiple locations, Kingston supports customer production requirements and supports design-in specifications for manufacturing and shipping globally.

Engineering support

Live FAE and technical resource support is available during the design-in phase. For troubleshooting, Kingston maintains an in-house lab with multiple chipset platforms available.

        Back To Top