What makes Kingston unique?
Kingston has the expertise to deliver what you need, when you need it. Our lead time is exceptionally short, way ahead of the industry norm. And we can respond quickly to changing requests.
If your organization has specific requirements, Kingston can accommodate them. Flexible shipment logistics mean we can drop ship to multiple locations and schedule shipping around production requirements.
Each project is tracked and supported, from sample to mass production. A free evaluation sample ships directly from Kingston to the customer, and FAE support is available to answer customers’ technical questions.
Kingston works closely with chipset vendors, distributors and manufacturers around the globe to support customer needs. See partners
Exceptional customer support
Tight BOM control means you get exactly what you want, every time. Part numbers are locked to configuration and firmware. There’s a pre-SMT programming service for your convenience and support for every customer, big or small.
Kingston works with many chipset vendors to test and qualify products and has an in-house lab for internal component testing and compatibility testing on multiple chipset platforms.
Backend packaging technology
ISO/TS16949 certified manufacturing facilities allow for mass production with advanced multi-die stacking packaging technology plus advanced memory testing equipment. Kingston maintains a high standard for quality control and product reliability testing.
Leveraging high volume material purchasing means we can maintain competitive pricing. Look to us for global high-volume, mass production facilities with advanced manufacturing technology and expertise.
With fast production turnaround times and ability to drop ship to multiple locations, Kingston supports customer production requirements and supports design-in specifications for manufacturing and shipping globally.
Live FAE and technical resource support is available during the design-in phase. For troubleshooting, Kingston maintains an in-house lab with multiple chipset platforms available.