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Embedded Products

Kingston offers a variety of embedded memory products, including eMMC and DRAM components, to customers worldwide. These products are ideal for memory and storage for many embedded applications.



DRAM Components



  • Kingston eMMC

    Kingston eMMC™ is an embedded, non-volatile memory system, comprised of both Flash memory and a Flash memory controller, which simplifies the application interface design and frees the host processor from low-level Flash memory management. eMMC is a popular storage component for many consumer electronic devices, including smartphones, tablets and Mobile Internet Devices. It is increasingly adopted in many industrial and embedded applications.

    For developers, eMMC simplifies the interface design and qualification process, resulting in a reduction in time to market and facilitates support for future Flash device offerings.

  • Small BGA package sizes and low power consumption make eMMC a viable, low-cost memory solution for mobile and other space-constrained products. The technology specifications of eMMC are managed by JEDEC, the global leader in developing open standards for the microelectronics industry.

    Kingston I-Temp eMMC

    Kingston’s wide-temp eMMC product offers JEDEC eMMC 5.0 features and backward compatibility to previous eMMC standards. It has all of the advantages of standard eMMC and the operating temperature range of the device meets industrial operating temperature requirements (-40°C~85°C), making it an ideal storage solution for harsh outdoor environment applications.

    • eMMC Part Numbers and Specifications

      Part No. Capacity Description eMMC Standard Package Category
      EMMC04G-S100 4GB eMMC 5.0 (HS200) 153B 4GB 5.0 (HS200) 11.5 x 13 x 1.0 Standard
      EMMC08G-S100 8GB eMMC 5.0 (HS200) 153B 8GB 5.0 (HS200) 11.5 x 13 x 1.0 Standard
      EMMC16G-S100 16GB eMMC 5.0 (HS200) 153B 16GB 5.0 (HS200) 11.5x13x1.0 Standard
      EMMC16G-S110 16GB eMMC 5.0 (HS200) 153B 16GB 5.0 (HS200) 11.5x13x1.0 Standard
      EMMC32G-S100 32GB eMMC 5.0 (HS200) 153B 32GB 5.0 (HS200) 11.5x13x1.0 Standard
      EMMC16G-E100 16GB eMMC 5.0(HS400) 153B 16GB 5.0(HS400) 11.5x13x1.0 Elite
      EMMC32G-E100 32GB eMMC 5.0(HS400) 153B 32GB 5.0(HS400) 11.5x13x1.0 Elite
      EMMC64G-E100 64GB eMMC 5.0(HS400) 153B 64GB 5.0(HS400) 11.5x13x1.4 Elite
      EMMC04G-W100 4GB Industrial Operating Temperature eMMC 5.0(HS200) 153B 4GB 5.0(HS200) 11.5x13x1.0 I-temp
      EMMC08G-W100 8GB Industrial Operating Temperature eMMC 5.0(HS200) 153B 8GB 5.0(HS200) 11.5x13x1.0 I-temp
      EMMC16G-W110 16GB Industrial Operating Temperature eMMC 5.0(HS200) 153B 16GB 5.0(HS200) 11.5x13x1.0 I-temp
      EMMC32G-W100 32GB Industrial Operating Temperature eMMC 5.0(HS200) 153B 32GB 5.0(HS200) 11.5x13x1.0 I-temp
      EMMC64G-W100 64GB Industrial Operating Temperature eMMC 5.0(HS400) 153B 64GB 5.0(HS400) 11.5x13x1.4 I-temp
    • Kingston eMMC Adapter

      For designs that don't have an eMMC footprint laid out yet, these eMMC to SD/MMC adapters let users test eMMC through an SD/MMC slot without changing the PCB layout.

    • eMMC Adapter Part Numbers

      Part No. Capacity Soldered on eMMC
      H2100659-001.C00 4GB EMMC04G-S100
      H2100659-002.C00 8GB EMMC08G-S100
      H2100659-003.C00 16GB EMMC16G-S100
      H2100659-004.C00 16GB EMMC16G-S110
      H2100659-005.C00 32GB EMMC32G-S100
      H2100659-006.C00 16GB EMMC16G-E100
      H2100659-008.C00 32GB EMMC32G-E100
      H2100659-009.C00 64GB EMMC64G-E100
  • Kingston MCP

    The Kingston MCP component comes with JEDEC standard ballout. It integrates SLC NAND Flash with LPDRAM inside one small footprint package. Its compact size and low power consumption make it an ideal memory solution for many IoT and wearable applications. MCP with Industrial operating temperature range (-40°C~85°C) is also available.

    • MCP Part Numbers and Specifications

      MCP P/Ns SLC NAND Capacity LPDDR2 Capacity Description Package DRAM Speed Operating Temperature
      KSLCMAL2TA0M2A 2Gb 1Gb 2Gb x8 SLC NAND + 1Gb x32 LPDDR2 162 ball MCP 8x10.5x1.0 800 Mbps -25°C~+85°C
      KSLCMBL2VA2M2A 4Gb 2Gb 4Gb x8 SLC NAND + 2Gb x32 LPDDR2 162 ball MCP 8x10.5x1.0 1066 Mbps -25°C~+85°C
      KSLCMAL2TA0M2C 2Gb 1Gb I-temp 2Gb x8 SLC NAND + 1Gb x32 LPDDR2 162 ball MCP 8x10.5x1.0 800 Mbps -40°C~+85°C
      KSLCMBL2VA2M2C 4Gb 2Gb I-temp 4Gb x8 SLC NAND + 2Gb x32 LPDDR2 162 ball MCP 8x10.5x1.0 1066 Mbps -40°C~+85°C
  • Kingston Embedded DRAM

    Kingston DRAM components are designed to meet the needs of embedded applications and offer a low voltage option for lower power consumption.

    • Standard and I-Temp Part Numbers and Specifications

      DDR3/3L PN Capacity Description Package Configuration (Words x Bits) Speed Mbps VDD, VDDQ Operating Temp.
      D2516EC4BXGGB 4Gb 96 ball FBGA DDR3/3L 9.0x13.5x1.2 256MX16 1600/1333 1.35V* 0°C ~ +95°C
      D5128EETBPGGBU 4Gb 78 ball FBGA DDR3/3L 9.0x10.6x1.2 512Mx8 1600/1333 1.35V* 0°C ~ +95°C
      D2516EC4BXGGBI 4Gb 96 ball FBGA DDR3/3L IT 9.0x13.5x1.2 256MX16 1600/1333 1.35V* -40°C ~ +95°C
      D5128EC4BPGGBUI 4Gb 78 ball FBGA DDR3/3L IT 9.0x10.6x1.2 512Mx8 1600/1333 1.35V* -40°C ~ +95°C
  • Kingston mSATA

    Kingston’s SSDNow ms200 mSATA solid-state drive offers a cost-effective performance boost with dual-drive option that allows room for adding high-capacity storage. Ideal for system builders, OEMs and enthusiasts, ms200’s ruggedly cool, miniscule form factor is eight times smaller than a traditional 2.5-inch hard drive, making it perfect for notebooks, tablets and Ultrabooks. Available in capacities up to 480GB, ms200 has a caseless, PCB-only design with no moving parts and is backed by a three-year warranty (30GB model has a two-year warranty) free technical support and legendary Kingston® reliability.

  • Features

    • mSATA interface — fully compliant with industry standard, easy to fit, guaranteed to work
    • NAND Flash memory based — shock resistant with low power consumption
    • Supports Intel’s SRT — combines capacity advantage of HDD with performance improvements of SSD in dual-storage configuration
    • Supports S.M.A.R.T. — monitors the status of your drive
    • Supports TRIM — maintains maximum performance on compatible operating systems
    • Guaranteed — three-year warranty (30GB model has a two-year warranty), free technical support
  • Kingston m.2

    Kingston’s M.2 SATA G2 SSD is a compact, caseless internal solid-state drive that combines high capacity with low power consumption. Lighter weight than a cased SSD, the M.2 SATA G2 SSD optimizes performance with advanced garbage collection, wear-leveling, TRIM support5 and DevSleep. Suitable for Small Form Factor (SFF) PCs, the M.2 2280 SATA G2 SSD easily integrates into designs with M.2 connectors. The complimentary Kingston SSD Manager (KSM) monitors warranty status and SSD health.

  • Features

    • Space-saving caseless design fits ultra-thin computing applications
    • Multi-purpose SFF connector replaces small mSATA and mini-PCIe slots
    • Capacities up to 480GB1
    • M.2 Gen 2 SSDs are backed by a limited five-year warranty6

What makes Kingston unique?


Kingston has the expertise to deliver what you need, when you need it. Our lead time is exceptionally short, way ahead of the industry norm. And we can respond quickly to changing requests.


If your organization has specific requirements, Kingston can accommodate them. Flexible shipment logistics mean we can drop ship to multiple locations and schedule shipping around production requirements.

Direct support

Each project is tracked and supported, from sample to mass production. A free evaluation sample ships directly from Kingston to the customer, and FAE support is available to answer customers’ technical questions.

Industry alliances

Kingston works closely with chipset vendors, distributors and manufacturers around the globe to support customer needs. See partners

Exceptional customer support

Tight BOM control means you get exactly what you want, every time. Part numbers are locked to configuration and firmware. There’s a pre-SMT programming service for your convenience and support for every customer, big or small.


Chipset validation

Kingston works with many chipset vendors to test and qualify products and has an in-house lab for internal component testing and compatibility testing on multiple chipset platforms.

Backend packaging technology

ISO/TS16949 certified manufacturing facilities allow for mass production with advanced multi-die stacking packaging technology plus advanced memory testing equipment. Kingston maintains a high standard for quality control and product reliability testing.

High volume

Leveraging high volume material purchasing means we can maintain competitive pricing. Look to us for global high-volume, mass production facilities with advanced manufacturing technology and expertise.

Logistical support

With fast production turnaround times and ability to drop ship to multiple locations, Kingston supports customer production requirements and supports design-in specifications for manufacturing and shipping globally.

Engineering support

Live FAE and technical resource support is available during the design-in phase. For troubleshooting, Kingston maintains an in-house lab with multiple chipset platforms available.