The Intel® Xeon® 6 Processor Platform code-named “Birch Stream” is engineered to suit the diverse requirements of next-generation data centers in multiple configurations of 1P, 2P, 4P, and 8P with a broad range of processors. Built using Intel 3 lithography, Xeon 6 is available in performance (P-Core) and efficiency (E-Core) classes across four series, providing the precise level of compute power needed for data center architects to design the best fit for their applications.

Targeting the demands of the maximum performance 1P/2P server segment is the Advanced Platform (AP) and Xeon 6900-series processors. Available with both P- and E-Cores, the 6900-series provides a 12-channel memory architecture supporting up to 6400MT/s DDR5 Registered DIMMs (RDIMMs), as well as new high performance 8800MT/s Multiplexed-Rank DIMMs (MRDIMMs).

The enhanced performance 1P/2P/4P/8P server segment is designed into the Scalable Platform (SP) with the Xeon 6700-series and 6500-series processors. Also available with both P- and E-Cores, the 6700/6500-series features an 8-channel memory architecture supporting up to 6400MT/s DDR5 Registered DIMMs (RDIMMs), and 8000MT/s Multiplexed-Rank DIMMs (MRDIMMs).

Series Designed for
Intel Xeon 6900-series processors Maximum performance ideal for the most demanding cloud, AI, and HPC environments
Intel Xeon 6700-series processors Enhanced performance ideal for a wide array of data center and telco environments
Intel Xeon 6500-series processors Essential performance ideal for mainstream server and edge environments
Intel Xeon 6300-series processors Entry-level performance ideal for small/medium business environments
Targeted Uses
Cloud Computing Software-as-a-Service (SaaS) Research and Development
Edge-to-Cloud Infrastructure-as-a-Service (IaaS) Application Development
Multi-cloud Workloads Digital Service Providers HPC (High Performance Computing)
Mainstream and Enterprise IT Infrastructure Telco Next-generation virtual Networks
Artificial Intelligence (AI) Real-time and Data Analytics Mission Critical

Memory Architecture

Memory architecture is based on Eight Channels arranged in Two Banks per processor. Each processor can be configured with 8 or 16 modules, depending on the motherboard layout, to achieve the maximum aggregated memory bandwidth.

A diagram of memory architecture: eight channels arranged in two banks per processor.


Xeon 6 6700E Series (Sierra Forest-SP)

  • DDR5 Registered DIMMs (RDIMMs) up to 6400MT/s, equivalent to transfer rates of 51.2GB/s per module
  • 8 memory channels per processor
  • Up to 2 DIMMs per channel
  • Up to 16 DIMMs per processor
A memory architecture diagram featuring eight channels, each dividing into two banks.


Xeon 6 6700P/6500P Series (Granite Rapids-SP)

  • DDR5 Registered DIMMs (RDIMMs) up to 6400MT/s, equivalent to transfer rates of 51.2GB/s per module
  • DDR5 Multiplexed-Rank DIMMs (MRDIMMs) up to 8000MT/s, equivalent to 64GB/s per module
  • 8 memory channels per processor
  • Up to 2 DIMMs per channel
  • Up to 16 DIMMs per processor
A memory architecture diagram with 12 channels, leading to 12 banks.


Xeon 6 6900P/6900E Series (Granite Rapids-AP)

  • DDR5 Registered DIMMs (RDIMMs) up to 6400MT/s, equivalent to transfer rates of 51.2GB/s per module
  • DDR5 Multiplexed-Rank DIMMs (MRDIMMs) up to 8800MT/s, equivalent to 70.4GB/s per module
  • 12 memory channels per processor
  • Up to 1 DIMMs per channel
  • Up to 12 DIMMs per processor

Intel® XEON® 6 Population Rules

 
SIERRA FOREST-SP - 1 DPC
SIERRA FOREST-SP - 2 DPC
GRANITE RAPIDS-SP - 1 DPC
GRANITE RAPIDS-SP - 2 DPC
GRANITE RAPIDS-AP / SIERRA FOREST-AP - 1 DPC
 
SIERRA FOREST-SP - 1 DPC
SIERRA FOREST-SP - 2 DPC
GRANITE RAPIDS-SP - 1 DPC
GRANITE RAPIDS-SP - 2 DPC
GRANITE RAPIDS-AP / SIERRA FOREST-AP - 1 DPC
Motherboard Configuration
Motherboard Configuration
8 Channel, 16 sockets per CPU
8 Channel, 16 sockets per CPU
8 Channel, 16 sockets per CPU
8 Channel, 16 sockets per CPU
12 Channel, 12 sockets per CPU
Module Type (No Mixing in a Server)
Module Type (No Mixing in a Server)
1 DIMM per Channel 1 DPC
2 DIMMs per Channel 2 DPC
1 DIMM per Channel 1 DPC
2 DIMMs per Channel 2 DPC
1 DIMM per Channel 1 DPC
Registered DIMM (RDIMM, 3DS)
Registered DIMM (RDIMM, 3DS)
6400
5200
6400
5200
6400
Multiplexed-Rank DIMM (MRDIMM)
Multiplexed-Rank DIMM (MRDIMM)
8000*
8800
 
Motherboard Configuration
Module Type (No Mixing in a Server)
Registered DIMM (RDIMM, 3DS)
Multiplexed-Rank DIMM (MRDIMM)
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