eMCP – the perfect power efficient integrated storage solution for space-constrained mobile, IoT, and embedded applications
Kingston offers a range of JEDEC standard eMCP components. eMCP integrates Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Multi-Chip Package (MCP) with one small footprint. This solution provides greater integration, reducing overall size. eMCP is an ideal combined storage and memory component for space-constrained systems such as smartphones, tablets, wearables, and various “Internet of Things” (IoT) devices.
eMCP Part Numbers and Specifications
LPDDR3 based eMCP
Part Number | Capacity | Standard | Package | FBGA | Operating Temperature | ||
---|---|---|---|---|---|---|---|
NAND (GB) | DRAM (Gb) | eMMC | DRAM | (mm) | |||
04EM04-N3GM627 | 4 | 4 | 5.0 | LPDDR3 | 11.5x13.0x1.0 | 221 | -25°C ~ +85°C |
08EM08-N3GML36 | 8 | 8 | 5.1 | LPDDR3 | 11.5x13.0x1.0 | 221 | -25°C ~ +85°C |
16EM08-N3GTB29 | 16 | 8 | 5.1 | LPDDR3 | 11.5x13.0x1.0 | 221 | -25°C ~ +85°C |
16EM16-N3GTB29 | 16 | 16 | 5.1 | LPDDR3 | 11.5x13.0x1.0 | 221 | -25°C ~ +85°C |
32EM16-N3GTX29 | 32 | 16 | 5.1 | LPDDR3 | 11.5x13.0x1.0 | 221 | -25°C ~ +85°C |
32EM32-N3HTX29 | 32 | 32 | 5.1 | LPDDR3 | 11.5x13.0x1.1 | 221 | -25°C ~ +85°C |
64EM32-N3HTX29 | 64 | 32 | 5.1 | LPDDR3 | 11.5x13.0x1.1 | 221 | -25°C ~ +85°C |
LPDDR4x based eMCP
Part Number | Capacity | Standard | Package | FBGA | Operating Temperature | ||
---|---|---|---|---|---|---|---|
NAND (GB) | DRAM (Gb) | eMMC | DRAM | (mm) | |||
04EM08-M4EM627 | 4 | 8 | 5.1 | LPDDR4x | 8x9.5x0.8 | 149 | -25°C ~ +85°C |
16EM16-M4CTB29 | 16 | 16 | 5.1 | LPDDR4x | 11.5x13.0x1.0 | 254 | -25°C ~ +85°C |
32EM16-M4CTX29 | 32 | 16 | 5.1 | LPDDR4x | 11.5x13.0x1.0 | 254 | -25°C ~ +85°C |
32EM32-M4DTX29 | 32 | 32 | 5.1 | LPDDR4x | 11.5x13.0x1.0 | 254 | -25°C ~ +85°C |
64EM32-M4DTX29 | 64 | 32 | 5.1 | LPDDR4x | 11.5x13.0x1.0 | 254 | -25°C ~ +85°C |
128EM32-M4DTX29 | 128 | 32 | 5.1 | LPDDR4x | 11.5x13.0x1.1 | 254 | -25°C ~ +85°C |