ePoP – Embedded Package-on-Package memory for Wearables
Kingston’s ePoP provides a highly integrated JEDEC standard component that combines Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Package-on-Package (PoP) solution. ePoP is mounted directly on top of a compatible host System-on-a-Chip (SoC), which reduces Printed Circuit Board (PCB) space, and ensures optimum performance. ePoP is an ideal solution for space constrained applications such as wearables.
ePoP Part Numbers and Specifications
LPDDR3 based ePoP
| Part Number | Capacity | Standard | Package | FBGA | Operating Temperature | ||
|---|---|---|---|---|---|---|---|
| NAND (GB) | DRAM (Gb) | eMMC | DRAM | (mm) | |||
| 04EP04-N3GM627 | 4 | 4 | 5.0 | LPDDR3 | 10x10x0.8 | 136 | -25°C ~ +85°C |
| 04EP08-N3GM627 | 4 | 8 | 5.0 | LPDDR3 | 10x10x0.85 | 136 | -25°C ~ +85°C |
| 08EP08-N3GTC32* | 8 | 8 | 5.1 | LPDDR3 | 10x10x0.85 | 136 | -25°C ~ +85°C |
| 32EP08-N3GTC32 | 32 | 8 | 5.1 | LPDDR3 | 10x10x0.85 | 136 | -25°C ~ +85°C |
LPDDR4x based ePoP
| Part Number | Capacity | Standard | Package | FBGA | Operating Temperature | ||
|---|---|---|---|---|---|---|---|
| NAND (GB) | DRAM (Gb) | eMMC | DRAM | (mm) | |||
| 08EP08-M4ETC32* | 8 | 8 | 5.1 | LPDDR4x | 8x9.5x0.8 | 144 | -25°C ~ +85°C |
| 08CP08-M4ETC32* | 8 | 8 | 5.1 | LPDDR4x | 8x9.5x0.85 | 144 | -25°C ~ +85°C |
| 16EP08-M4ETC32 | 16 | 8 | 5.1 | LPDDR4x | 8x9.5x0.8 | 144 | -25°C ~ +85°C |
| 32EP08-M4ETC32 | 32 | 8 | 5.1 | LPDDR4x | 8x9.5x0.8 | 144 | -25°C ~ +85°C |
| 16EP16-M4FTC32 | 16 | 16 | 5.1 | LPDDR4x | 8x9.5x0.8 | 144 | -25°C ~ +85°C |
| 32EP16-M4FTC32 | 32 | 16 | 5.1 | LPDDR4x | 8x9.5x0.8 | 144 | -25°C ~ +85°C |
| 32CP16-M4FTC32 | 32 | 16 | 5.1 | LPDDR4x | 8x9.5x0.85 | 144 | -25°C ~ +85°C |
