The “Milan” microarchitecture for DDR4 servers offers 19% faster performance, new security features, the world’s first true 3D die stacking technology in a server processor.
The AMD 3rd Generation EPYC™ processor code-named “Milan” launched in 2021 under the 7003 series. This evolution of the Zen series microarchitecture brought significant improvements over previous generations, and featured up to 64 cores on package, support for eight DDR4 channels, and 128 PCIe 4.0 lanes. This is the first 7nm technology server microprocessor from AMD, with lower TDP, saving data center energy costs while providing the world’s highest performance per core and throughput.
AMD 3rd Generation EPYC™ (Milan) 7003 Series
Memory architecture is based on Eight Channels arranged in Two Banks per processor. Each processor can be configured with 8 or 16 modules, depending on the motherboard layout, to achieve the maximum aggregated memory bandwidth.
(8 Channel, 16 sockets per CPU, 2 DPC)
Kingston can offer you an independent opinion and advice on the benefits of configuring your server for optimal performance & capacity. Kingston’s configuration experts have the knowledge and resources to support your memory upgrade needs.
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