32Gbit DRAM refers to memory chips with a density of 32 gigabits (Gb). These are planar (non-stacked) chips, that enable high-capacity modules without the use of 3D stacking technologies like Through-Silicon Via (TSV) or Dual-Die Package (DDP). Instead, DRAM semiconductor manufacturers use advanced lithography techniques to fit more memory cells into the same physical chip area. Compared to earlier 16Gbit or 24Gbit DDR5 chips, 32Gbit DRAM significantly increases the capacity of memory modules such as (C)UDIMMs, and (C)SODIMMs, RDIMMs and MRDIMMs. This allows systems to support higher memory capacities using the same form factor, helping reduce reliance on more complex and expensive stacked DRAM solutions.
FAQ: KTF-001002-006