eMCP – The perfect power-efficient integrated storage solution for space-constrained mobile, IoT and embedded applications

eMCP – The perfect power-efficient integrated storage solution for space-constrained mobile, IoT and embedded applications

Kingston offers a range of JEDEC standard eMCP components. eMCP integrates Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Multi-Chip Package (MCP) with one small footprint. This solution provides greater integration, reducing overall size. eMCP is an ideal combined storage and memory component for space-constrained systems, such as smartphones, tablets, wearables and various “Internet of Things” (IoT) devices.

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eMCP part numbers and specifications

LPDDR3-based eMCP
Part numberCapacityStandardPackageFBGAOperating temperature
NAND
(GB)
DRAM
(Gb)
eMMCDRAM(mm)
04EM04-N3GM627 4 4 5.0 LPDDR3 11.5x13.0x1.0 221 -25°C ~ +85°C
08EM08-N3GML36 8 8 5.1 LPDDR3 11.5x13.0x1.0 221 -25°C ~ +85°C
16EM08-N3GTB29 16 8 5.1 LPDDR3 11.5x13.0x1.0 221 -25°C ~ +85°C
16EM16-N3GTB29 16 8 5.1 LPDDR3 11.5x13.0x1.0 221 -25°C ~ +85°C
32EM16-N3GTX29 32 16 5.1 LPDDR3 11.5x13.0x1.0 221 -25°C ~ +85°C
32EM32-N3HTX29 32 32 5.1 LPDDR3 11.5x13.0x1.1 221 -25°C ~ +85°C
64EM32-N3HTX29 64 32 5.1 LPDDR3 11.5x13.0x1.1 221 -25°C ~ +85°C
LPDDR4x-based eMCP
Part numberCapacityStandardPackageFBGAOperating temperature
NAND
(GB)
DRAM
(Gb)
eMMCDRAM(mm)
04EM08-M4EM627 4 8 5.1 LPDDR4x 8x9.5x0.8 149 -25°C ~ +85°C
16EM16-M4CTB29 16 16 5.1 LPDDR4x 11.5x13.0x1.0 254 -25°C ~ +85°C
32EM16-M4CTX29 32 16 5.1 LPDDR4x 11.5x13.0x1.0 254 -25°C ~ +85°C
32EM32-M4DTX29 32 32 5.1 LPDDR4x 11.5x13.0x1.0 254 -25°C ~ +85°C
64EM32-M4DTX29 64 32 5.1 LPDDR4x 11.5x13.0x1.0 254 -25°C ~ +85°C
128EM32-M4DTX29 128 32 5.1 LPDDR4x 11.5x13.0x1.1 254 -25°C ~ +85°C

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