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Embedded/Industrial
Embedded/Industrial

Embedded Discrete DRAM for device manufacturers

Kingston Embedded Discrete DRAM is designed to meet the needs of embedded devices and is available with low- voltage variants for reduced power consumption. Kingston Embedded Discrete DRAM is powering a variety of modern electronic infrastructures such as smart cities (HVAC, lighting, power monitoring and parking meters), industrial (robotics, IoT, factory automation, single-board computers) and telecommunications (5G networking, edge computing, communication models, Wi-Fi routers mesh devices), and devices such as smart home (sound bars, thermostats, fitness equipment, vacuums, beds and taps) and wearables (smart watches, health monitors, fitness trackers, AR, VR).

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KEY FEATURES

  • Double Data Rate (DDR) architecture: two data transfers per clock cycle
  • High-speed data transfer is realised by 8 bits prefetch pipelined architecture
  • Bi-directional differential data strobe (DOS and /DQS) is transmitted/received
  • DOS is edge-aligned with data for READS; centre-aligned with data for WRITES
  • Differential clock inputs (CK and /CK)
  • DLL aligns DQ and DOS transitions with CK transitions
  • Commands entered on each positive CK edge; data and data mask referenced
  • Data Mask (DM) for write data
  • Posted /CAS by programmable additive latency for better command and data
  • On-Die Termination (ODD) for better signal quality
    • Synchronous ODT
    • Dynamic CDT
    • Asynchronous ODT
  • Multi-Purpose Register (MPR) for pre-defined pattern read out
  • ZQ calibration for DO drive and ODT
  • Programmable Partial Array Self-Refresh (PASR)
  • RESET pin for power-up sequence and reset function
  • SRT range: normal/extended
  • Programmable output driver impedance control

Standard part numbers and specifications

DDR3/DDR3L FBGA Commercial Temp

Part numberCapacityDescriptionPackageVDD,
VDDQ		Operating
temperature
D1216ECMDXGJD 2Gb 96 ball 128Mx16 DDR3/3L 1866Mbps 7.5x13.5x1.2 1.35V{{Footnote.N64253}} 0°C ~ +95°C
D2516ECMDXGJD 4Gb 96 ball 256Mx16 DDR3/3L 1866Mbps 7.5x13.5x1.2 1.35V{{Footnote.N64253}} 0°C ~ +95°C
D5128ECMDPGJD 4Gb 78 ball 512Mx8 DDR3/3L 1866Mbps 7.5x10.6x1.2 1.35V{{Footnote.N64253}} 0°C ~ +95°C
D2516ECMDXGME 4Gb 96 ball 256Mx16 DDR3/3L 2133Mbps 7.5x13.5x1.2 1.35V{{Footnote.N64253}} 0°C ~ +95°C
B5116ECMDXGJD 8Gb 96 ball 512Mx16 DDR3/3L 1866Mbps 9x13.5x1.2 1.35V{{Footnote.N64253}} 0°C ~ +95°C

DDR3/DDR3L FBGA Industrial Temp

Part numberCapacityDescriptionPackageVDD,
VDDQ		Operating
temperature
D1216ECMDXGJDI 2Gb 96 ball 128Mx16 DDR3/3L 1866Mbps 7.5x13.5x1.2 1.35V{{Footnote.N64253}} -40°C ~ +95°C
D2568ECMDPGJDI 2Gb 78 ball 256Mx8 DDR3/3L 1866Mbps 7.5x10.6x1.2 1.35V{{Footnote.N64253}} -40°C ~ +95°C
D2516ECMDXGJDI 4Gb 96 ball 256Mx16 DDR3/3L 1866Mbps 7.5x13.5x1.2 1.35V{{Footnote.N64253}} -40°C ~ +95°C
D5128ECMDPGJDI 4Gb 78 ball 512Mx8 DDR3/3L 1866Mbps 7.5x10.6x1.2 1.35V{{Footnote.N64253}} -40°C ~ +95°C
D2516ECMDXGMEI 4Gb 96 ball 256Mx16 DDR3/3L 2133Mbps 7.5x13.5x1.2 1.35V{{Footnote.N64253}} -40°C ~ +95°C
B5116ECMDXGJDI 8Gb 96 ball 512Mx16 DDR3/3L 1866Mbps 9x13.5x1.2 1.35V{{Footnote.N64253}} -40°C ~ +95°C

DDR3/DDR3L FBGA Automotive Temp

Part numberCapacityDescriptionPackageVDD,
VDDQ		Operating temperature
D1216ECMDXGMEY 2Gb 96-ball 128Mx16 DDR3/3L 2133Mbps 13.5x7.5x1.2 1.35V{{Footnote.N64253}} -40°C ~ +105°C
D2516ECMDXGMEY 4Gb 96-ball 256Mx16 DDR3/3L 2133Mbps 13.5x7.5x1.2 1.35V{{Footnote.N64253}} -40°C ~ +105°C

DDR4 FBGA Commercial Temp

Part numberCapacityDescriptionPackageVDD,
VDDQ		Operating
temperature
D5116AN9CXGRK 8Gb 96 ball 512Mx16 DDR4 2666Mbps 7.5x13x1.1 1.2V 0°C ~ +95°C
D5116AN9CXGXN 8Gb 96 ball 512Mx16 DDR4 3200Mbps 7.5x13x1.1 1.2V 0°C ~ +95°C
D2516ACXGXGRK 4Gb 96 ball 256Mx16 DDR4 2666Mbps 7.5x13x1.1 1.2V 0°C ~ +95°C

DDR4 FBGA Industrial and Automotive Temp

Part numberCapacityDescriptionPackageVDD,
VDDQ		Operating
temperature
D2516AN9EXGXNI-U 4Gb 96 ball 256Mx16 DDR4 3200Mbps 7.5x13x1.1 1.2V -40°C ~ +95°C
D5116AN9CXGXNI 8Gb 96 ball 512Mx16 DDR4 3200Mbps 7.5x13x1.1 1.2V -40°C ~ +95°C
D1028AN9CPGXNI 8Gb 78 ball 512Mx8 DDR4 3200Mbps 7.5x13x1.1 1.2V -40°C ~ +95°C
D5116AN9CXGXNY-U 8Gb 96 ball 512Mx16 DDR4 3200Mbps 7.5x13x1.1 1.2V -40°C ~ +95°C

LPDDR4 FBGA Commercial Temp

Part NumberCapacityDescriptionPackageVDD,
VDDQ		Operating
Temperature
D1621PM4CDGUI-U 16Gb 200 ball 512Mx32 LPDDR4 3733Mbps 10x14.5x0.8 1.1V -25°C ~ +85°C
D1611PM3BDGUI-U 16Gb 200 ball 1Gx16 LPDDR4 3733Mbps 10x14.5x0.8 1.1V -25°C ~ +85°C
C3222PM4CDGUI-U 32Gb 200 ball 1Gx32 LPDDR4 3733Mbps 10x14.5x0.8 1.1V -25°C ~ +85°C
B3221PM3BDGUI-U 32Gb 200 ball 1Gx32 LPDDR4 3733Mbps 10x14.5x0.8 1.1V -25°C ~ +85°C
Q6422PM3BDGVK-U 64Gb 200 ball 2Gx32 LPDDR4 4266Mbps 10x14.5x1.0 1.1V -25°C ~ +85°C

LPDDR4 FBGA Industrial Temp

Part NumberCapacityDescriptionPackageVDD,
VDDQ		Operating
Temperature
D1621PM4CDGUIW-U 16Gb 200 ball 512Mx32 LPDDR4 3733Mbps 10x14.5x0.8 1.1V -40°C ~ +95°C
D1611PM3BDGVIW-U 16Gb 200 ball 1Gx16 LPDDR4 4266Mbps 10x14.5x0.8 1.1V -40°C ~ +95°C
C3222PM4CDGUIW-U 32Gb 200 ball 1Gx32 LPDDR4 3733Mbps 10x14.5x0.8 1.1V -40°C ~ +95°C
B3221PM3BDGVIW-U 32Gb 200 ball 1Gx32 LPDDR4 4266Mbps 10x14.5x0.8 1.1V -40°C ~ +95°C

LPDDR4x FBGA Commercial Temp

Part NumberCapacityDescriptionPackageVDD,
VDDQ		Operating
Temperature
D1621XM4CDGVI-U 16Gb 200 ball 512Mx32 LPDDR4x 4266Mbps 10x14.5x0.8 0.6V -25°C ~ +85°C
B3221XM3BDGVI-U 32Gb 200 ball 1Gx32 LPDDR4x 4266Mbps 10x14.5x0.8 0.6V -25°C ~ +85°C
Q6422XM3BDGVK-U 64Gb 200 ball 2Gx32 LPDDR4x 4266Mbps 10x14.5x0.8 0.6V -25°C ~ +85°C