Embedded DRAM Components for device manufacturers

Kingston DRAM components are designed to meet the needs of embedded devices and are available with low- voltage variants for reduced power consumption.

Request Information

Standard part numbers and specifications

DDR3/DDR3L FBGA Commercial Temp

Part numberCapacityDescriptionPackageVDD,
VDDQ		Operating
temperature
D1216ECMDXGJD 2Gb 96 ball 128Mx16 DDR3/3L 1866Mbps 7.5x13.5x1.2 1.35V1 0°C ~ +95°C
D2568ECMDPGJD 2Gb 78 ball 256Mx8 DDR3/3L 1866Mbps 7.5x10.6x1.2 1.35V1 0°C ~ +95°C
D2516ECMDXGJD 4Gb 96 ball 256Mx16 DDR3/3L 1866Mbps 7.5x13.5x1.2 1.35V1 0°C ~ +95°C
D5128ECMDPGJD 4Gb 78 ball 512Mx8 DDR3/3L 1866Mbps 7.5x10.6x1.2 1.35V1 0°C ~ +95°C
D2516ECMDXGME 4Gb 96 ball 256Mx16 DDR3/3L 2133Mbps 7.5x13.5x1.2 1.35V1 0°C ~ +95°C
B5116ECMDXGJD 8Gb 96 ball 512Mx16 DDR3/3L 1866Mbps 9x13.5x1.2 1.35V1 0°C ~ +95°C

DDR3/DDR3L FBGA Industrial Temp

Part numberCapacityDescriptionPackageVDD,
VDDQ		Operating
temperature
D1216ECMDXGJDI 2Gb 96 ball 128Mx16 DDR3/3L 1866Mbps 7.5x13.5x1.2 1.35V1 -40°C ~ +95°C
D2568ECMDPGJDI 2Gb 78 ball 256Mx8 DDR3/3L 1866Mbps 7.5x10.6x1.2 1.35V1 -40°C ~ +95°C
D2516ECMDXGJDI 4Gb 96 ball 256Mx16 DDR3/3L 1866Mbps 7.5x13.5x1.2 1.35V1 -40°C ~ +95°C
D5128ECMDPGJDI 4Gb 78 ball 512Mx8 DDR3/3L 1866Mbps 7.5x10.6x1.2 1.35V1 -40°C ~ +95°C
D2516ECMDXGMEI 4Gb 96 ball 256Mx16 DDR3/3L 2133Mbps 7.5x13.5x1.2 1.35V1 -40°C ~ +95°C
B5116ECMDXGJDI 8Gb 96 ball 512Mx16 DDR3/3L 1866Mbps 9x13.5x1.2 1.35V1 -40°C ~ +95°C

DDR4 FBGA Commercial Temp

Part numberCapacityDescriptionPackageVDD,
VDDQ		Operating
temperature
D5116AN9CXGRK 8Gb 96 ball FBGA DDR4 C-Temp 7.5x13x1.2 1.2V 0°C ~ +95°C
D5116AN9CXGXN 8Gb 96 ball FBGA DDR4 C-Temp 7.5x13x1.2 1.2V 0°C ~ +95°C
D2516ACXGXGRK 4Gb 96 ball FBGA DDR4 C-Temp 7.5x13x1.2 1.2V 0°C ~ +95°C

DDR4 FBGA Industrial Temp

Part numberCapacityDescriptionPackageVDD,
VDDQ		Operating
temperature
D5116AN9CXGXNI 8Gb 96 ball FBGA DDR4 I-Temp x16 7.5x13x1.2 1.2V -40°C ~ +95°C
D1028AN9CPGXNI 8Gb 96 ball FBGA DDR4 I-Temp x8 7.5x13x1.2 1.2V -40°C ~ +95°C