Embedded DRAM Components for device manufacturers

Kingston DRAM components are designed to meet the needs of embedded devices and are available with low- voltage variants for reduced power consumption.

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Standard Part Numbers and Specifications

DDR3/3L PN Capacity Description Package Configuration
(Words x Bits)		 Speed Mbps VDD, VDDQ Operating Temp.
D1216ECMDXGJD 2Gb 96 ball FBGA DDR3/3L 7.5x13.5x1.2 128Mx16 1866 Mbps 1.35V 0°C ~ +95°C
D2568ECMDPGJD 2Gb 78 ball FBGA DDR3/3L 7.5x13.5x1.2 256Mx8 1866 Mbps 1.35V 0°C ~ +95°C
D2516ECMDXGJD 4Gb 96 ball FBGA DDR3/3L 7.5x13.5x1.2 256Mx16 1866 Mbps 1.35V 0°C ~ +95°C
D5128ECMDPGJD 4Gb 78 ball FBGA DDR3/3L 7.5x10.6x1.2 512Mx8 1866 Mbps 1.35V 0°C ~ +95°C
D2516ECMDXGME 4Gb 96 ball FBGA DDR3/3L 7.5x13.5x1.2 256Mx16 2133 Mbps 1.35V 0°C ~ +95°C
D1216ECMDXGJDI 2Gb 96 ball FBGA DDR3/3L I-Temp 7.5x13.5x1.2 128Mx16 1866 Mbps 1.35V -40°C ~ +95°C
D2568ECMDPGJDI 2Gb 78 ball FBGA DDR3/3L I-Temp 7.5x13.5x1.2 256Mx8 1866 Mbps 1.35V -40°C ~ +95°C
D2516ECMDXGJDI 4Gb 96 ball FBGA DDR3/3L I-Temp 7.5x13.5x1.2 256Mx16 1866 Mbps 1.35V -40°C ~ +95°C
D5128ECMDPGJDI 4Gb 78 ball FBGA DDR3/3L I-Temp 7.5x10.6x1.2 512Mx8 1866 Mbps 1.35V -40°C ~ +95°C

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