Embedded Discrete DRAM for Device Manufacturers

Kingston Embedded Discrete DRAM is designed to meet the needs of embedded devices and are available with low- voltage variants for reduced power consumption. Kingston Embedded Discrete DRAM is powering a variety of modern electronic infrastructures such as smart cities (HVAC, lighting, power monitoring and metering parking meters), industrial (robotics, IoT, factory automation, single board computers), telecommunications (5G networking, edge computing, communication models, WiFi routers mesh devices), and devices such as smart home (sound bars, thermostats, fitness equipment, vacuums, beds, and faucets), and wearables (smart watches, health monitors, fitness trackers, AR, VR).
KEY FEATURES
- Double Data Rate (DDR) architecture: two data transfers per clock cycle
- High-speed data transfer is realized by 8 bits prefetch pipelined architecture
- Bi-directional differential data strobe (DOS and /DQS) is transmitted/received with data for capturing data at the receiver
- DOS is edge-aligned with data for READS; center-aligned with data for WRITES
- Differential clock inputs (CK and /CK)
- DLL aligns DQ and DOS transitions with CK transitions
- Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS to both edges of DQS
- Data Mask (DM) for write data
- Posted /CAS by programmable additive latency for better command and data bus efficiency
- On-Die Termination (ODD for better signal quality)
- Synchronous ODT
- Dynamic CDT
- Asynchronous ODT
- Multi-Purpose Register (MPR) for pre-defined pattern read out
- ZQ calibration for DO drive and ODT
- Programmable Partial Array Self-Refresh (PASR)
- RESET pin for power-up sequence and reset function
- SRT range: normal/extended
- Programmable output driver impedance control
Standard Part Numbers and Specifications
DDR3/DDR3L FBGA Commercial Temp
Part Number | Capacity | Description | Package | VDD, VDDQ | Operating Temperature |
---|---|---|---|---|---|
D1216ECMDXGJD | 2Gb | 96 ball 128Mx16 DDR3/3L 1866Mbps | 7.5x13.5x1.2 | 1.35V{{Footnote.N64253}} | 0°C ~ +95°C |
D2516ECMDXGJD | 4Gb | 96 ball 256Mx16 DDR3/3L 1866Mbps | 7.5x13.5x1.2 | 1.35V{{Footnote.N64253}} | 0°C ~ +95°C |
D5128ECMDPGJD | 4Gb | 78 ball 512Mx8 DDR3/3L 1866Mbps | 7.5x10.6x1.2 | 1.35V{{Footnote.N64253}} | 0°C ~ +95°C |
D2516ECMDXGME | 4Gb | 96 ball 256Mx16 DDR3/3L 2133Mbps | 7.5x13.5x1.2 | 1.35V{{Footnote.N64253}} | 0°C ~ +95°C |
B5116ECMDXGJD | 8Gb | 96 ball 512Mx16 DDR3/3L 1866Mbps | 9x13.5x1.2 | 1.35V{{Footnote.N64253}} | 0°C ~ +95°C |
DDR3/DDR3L FBGA Industrial Temp
Part Number | Capacity | Description | Package | VDD, VDDQ | Operating Temperature |
---|---|---|---|---|---|
D1216ECMDXGJDI | 2Gb | 96 ball 128Mx16 DDR3/3L 1866Mbps | 7.5x13.5x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +95°C |
D2568ECMDPGJDI | 2Gb | 78 ball 256Mx8 DDR3/3L 1866Mbps | 7.5x10.6x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +95°C |
D2516ECMDXGJDI | 4Gb | 96 ball 256Mx16 DDR3/3L 1866Mbps | 7.5x13.5x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +95°C |
D5128ECMDPGJDI | 4Gb | 78 ball 512Mx8 DDR3/3L 1866Mbps | 7.5x10.6x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +95°C |
D2516ECMDXGMEI | 4Gb | 96 ball 256Mx16 DDR3/3L 2133Mbps | 7.5x13.5x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +95°C |
B5116ECMDXGJDI | 8Gb | 96 ball 512Mx16 DDR3/3L 1866Mbps | 9x13.5x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +95°C |
DDR3/DDR3L FBGA Automotive Temp
Part Number | Capacity | Description | Package | VDD, VDDQ | Operating Temperature |
---|---|---|---|---|---|
D1216ECMDXGMEY | 2Gb | 96 ball 128Mx16 DDR3/3L 2133Mbps | 13.5x7.5x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +105°C |
D2516ECMDXGMEY | 4Gb | 96 ball 256Mx16 DDR3/3L 2133Mbps | 13.5x7.5x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +105°C |
DDR4 FBGA Commercial Temp
Part Number | Capacity | Description | Package | VDD, VDDQ | Operating Temperature |
---|---|---|---|---|---|
D5116AN9CXGRK | 8Gb | 96 ball 512Mx16 DDR4 2666Mbps | 7.5x13x1.2 | 1.2V | 0°C ~ +95°C |
D5116AN9CXGXN | 8Gb | 96 ball 512Mx16 DDR4 3200Mbps | 7.5x13x1.2 | 1.2V | 0°C ~ +95°C |
D2516ACXGXGRK | 4Gb | 96 ball 256Mx16 DDR4 2666Mbps | 7.5x13x1.2 | 1.2V | 0°C ~ +95°C |
DDR4 FBGA Industrial & Automotive Temp
Part Number | Capacity | Description | Package | VDD, VDDQ | Operating Temperature |
---|---|---|---|---|---|
D2516AN9EXGXNI-U | 4Gb | 96 ball 256Mx16 DDR4 3200Mbps | 7.5x13x1.1 | 1.2V | -40°C ~ +95°C |
D5116AN9CXGXNI | 8Gb | 96 ball 512Mx16 DDR4 3200Mbps | 7.5x13x1.1 | 1.2V | -40°C ~ +95°C |
D1028AN9CPGXNI | 8Gb | 78 ball 512Mx8 DDR4 3200Mbps | 7.5x13x1.1 | 1.2V | -40°C ~ +95°C |
D5116AN9CXGXNY-U | 8Gb | 96 ball 512Mx16 DDR4 3200Mbps | 7.5x13x1.1 | 1.2V | -40°C ~ +95°C |
LPDDR4 FBGA Commercial Temp
Part Number | Capacity | Description | Package | VDD, VDDQ | Operating Temperature |
---|---|---|---|---|---|
D1621PM4CDGUI-U | 16Gb | 200 ball 512Mx32 LPDDR4 3733Mbps | 10x14.5x0.8 | 1.1V | -25°C ~ +85°C |
D1611PM3BDGUI-U | 16Gb | 200 ball 1Gx16 LPDDR4 3733Mbps | 10x14.5x0.8 | 1.1V | -25°C ~ +85°C |
C3222PM4CDGUI-U | 32Gb | 200 ball 1Gx32 LPDDR4 3733Mbps | 10x14.5x0.8 | 1.1V | -25°C ~ +85°C |
B3221PM3BDGUI-U | 32Gb | 200 ball 1Gx32 LPDDR4 3733Mbps | 10x14.5x0.8 | 1.1V | -25°C ~ +85°C |
Q6422PM3BDGVK-U | 64Gb | 200 ball 2Gx32 LPDDR4 4266Mbps | 10x14.5x1.0 | 1.1V | -25°C ~ +85°C |
LPDDR4 FBGA Industrial Temp
Part Number | Capacity | Description | Package | VDD, VDDQ | Operating Temperature |
---|---|---|---|---|---|
D1621PM4CDGUIW-U | 16Gb | 200 ball 512Mx32 LPDDR4 3733Mbps | 10x14.5x0.8 | 1.1V | -40°C ~ +95°C |
D1611PM3BDGVIW-U | 16Gb | 200 ball 1Gx16 LPDDR4 4266Mbps | 10x14.5x0.8 | 1.1V | -40°C ~ +95°C |
C3222PM4CDGUIW-U | 32Gb | 200 ball 1Gx32 LPDDR4 3733Mbps | 10x14.5x0.8 | 1.1V | -40°C ~ +95°C |
B3221PM3BDGVIW-U | 32Gb | 200 ball 1Gx32 LPDDR4 4266Mbps | 10x14.5x0.8 | 1.1V | -40°C ~ +95°C |
LPDDR4x FBGA Commercial Temp
Part Number | Capacity | Description | Package | VDD, VDDQ | Operating Temperature |
---|---|---|---|---|---|
D1621XM4CDGVI-U | 16Gb | 200 ball 512Mx32 LPDDR4x 4266Mbps | 10x14.5x0.8 | 0.6V | -25°C ~ +85°C |
B3221XM3BDGVI-U | 32Gb | 200 ball 1Gx32 LPDDR4x 4266Mbps | 10x14.5x0.8 | 0.6V | -25°C ~ +85°C |
Q6422XM3BDGVK-U | 64Gb | 200 ball 2Gx32 LPDDR4x 4266Mbps | 10x14.5x1.0 | 0.6V | -25°C ~ +85°C |