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Embedded Solutions

Embedded Products

Kingston offers a variety of embedded memory products, including eMMC and DRAM components, to customers worldwide. These products are ideal for memory and storage for many embedded applications.

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eMCP

Kingston offers a wide range of JEDEC standard eMCP components. eMCP integrates eMMC and low-power DRAM into a package with one small footprint. This solution simplifies system PCB design and speeds time to market. eMCP is an ideal combined storage and memory component for space-constrained systems such as smartphones, tablets, wearables, and various IoT devices.

eMCP Part Numbers and Specifications
LPDDR2 eMCP P/Ns LPDDR2 eMCP Capacity Speed Mode e•MMC version Package Size
04EMCP04-NL2DM627 4GB eMMC + 4Gb LPDDR2 HS200 5.0 11.5 x 13 x 1.0 (162 Ball)
08EMCP04-NL2DT227 8GB eMMC + 4Gb LPDDR2 HS200 5.0 11.5 x 13 x 1.0 (162 Ball)
08EMCP08-NL2DT227 8GB eMMC + 8Gb LPDDR2 HS200 5.0 11.5 x 13 x 1.0 (162 Ball)


LPDDR3 eMCP P/Ns LPDDR3 eMCP Capacity Speed Mode e•MMC version Package Size
04EMCP04-NL3DM627 4GB eMMC + 4Gb LPDDR3 HS400 5.0 11.5 x 13 x 1.0 (221 Ball)
08EMCP04-NL3DT227 8GB eMMC + 4Gb LPDDR3 HS400 5.0 11.5 x 13 x 1.0 (221 Ball)
08EMCP08-NL3DT227 8GB eMMC + 8Gb LPDDR3 HS400 5.0 11.5 x 13 x 1.0 (221 Ball)
16EMCP08-NL3DTB28 16GB eMMC + 8Gb LPDDR3 HS400 5.1 11.5 x 13 x 1.0 (221 Ball)
16EMCP16-EL3GTB29 16GB eMMC + 16Gb LPDDR3 HS400 5.1 11.5 x 13 x 1.0 (221 Ball)
32EMCP16-EL3GTB29 32GB eMMC + 16Gb LPDDR3 HS400 5.1 11.5 x 13 x 1.0 (221 Ball)
32EMCP24-EL3JTB29 32GB eMMC + 24Gb LPDDR3 HS400 5.1 11.5 x 13 x 1.0 (221 Ball)
64EMCP24-EL3JTA29 64GB eMMC + 24Gb LPDDR3 HS400 5.1 11.5 x 13 x 1.0 (221 Ball)
64EMCP32-EL3HTA29 64GB eMMC + 32Gb LPDDR3 HS400 5.1 11.5 x 13 x 1.1 (221 Ball)
What makes Kingston unique?
Agility

Kingston has the expertise to deliver what you need, when you need it. Our lead time is exceptionally short, way ahead of the industry norm. And we can respond quickly to changing requests.

Flexibility

If your organization has specific requirements, Kingston can accommodate them. Flexible shipment logistics mean we can drop ship to multiple locations and schedule shipping around production requirements.

Direct support

Each project is tracked and supported, from sample to mass production. A free evaluation sample ships directly from Kingston to the customer, and FAE support is available to answer customers’ technical questions.

Industry alliances

Kingston works closely with chipset vendors, distributors and manufacturers around the globe to support customer needs.  See partners

Exceptional customer support

Tight BOM control means you get exactly what you want, every time. Part numbers are locked to configuration and firmware. There’s a pre-SMT programming service for your convenience and support for every customer, big or small.

Services
Chipset validation

Kingston works with many chipset vendors to test and qualify products and has an in-house lab for internal component testing and compatibility testing on multiple chipset platforms.

Backend packaging technology

ISO/TS16949 certified manufacturing facilities allow for mass production with advanced multi-die stacking packaging technology plus advanced memory testing equipment. Kingston maintains a high standard for quality control and product reliability testing.

High volume

Leveraging high volume material purchasing means we can maintain competitive pricing. Look to us for global high-volume, mass production facilities with advanced manufacturing technology and expertise.

Logistical support

With fast production turnaround times and ability to drop ship to multiple locations, Kingston supports customer production requirements and supports design-in specifications for manufacturing and shipping globally.

Engineering support

Live FAE and technical resource support is available during the design-in phase. For troubleshooting, Kingston maintains an in-house lab with multiple chipset platforms available.

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