Intel 3rd Generation Xeon Scalable Processor Platform “Cedar Island”

The 3rd-Generation Intel® Scalable Processor Platform code-named “Cedar Island” featuring Cooper Lake-SP targets 4P and 8P servers. This microarchitecture adds new technologies from Intel®: Intel Deep Learning Boost, Intel Advanced Vector Extensions 512 and Intel Speed Select Technology. New AVX512-based instructions are a key upgrade over previous generations to provide increased performance on applications like artificial intelligence. Cooper Lake-SP doubles the interconnect bandwidth over Cascade Lake-SP with six UPI links running at 10.4 GT/s and increases memory frequency support to 3200MT/s in 1DPC (One DIMM per Channel) across six memory channels per processor. With enhanced hardware-based security and up to 40 cores, Cedar Island with the Cooper Lake-SP microarchitecture is ideal for data centers that require extreme and reliable performance.

Targeted Uses

  • Artificial intelligence
  • Multi-cloud workloads
  • HPC (High Performance Computing)
  • 5G-ready networks
  • Next-generation virtual networks
  • Real-time analytics
  • Mission critical
Cedar Island

At a glance

Xeon® SP 3rd Generation (Cooper Lake)

  • Supports up to 4.5TB (Terabytes) of memory per processor1
  • Supports DDR4 Registered and Load Reduced DIMMs up to 3200MT/s, equivalent to transfer rates of 25.6GB/s per module2

Memory architecture

 6 channels of memory

Memory architecture is based on Six Channels arranged in Two Banks per processor. Each processor can be configured with 6 or 12 modules, depending on the motherboard layout, to achieve the maximum aggregated memory bandwidth.

  • 6 memory channels per processor
  • Up to 2 DIMMs per channel
  • Up to 12 DIMMs per processor

Intel population rules

(6 channel, 12 sockets per CPU, 2 DPC)

 
Intel Xeon SP Gen 3 – ICE LAKE
Intel Xeon SP Gen 3 – ICE LAKE
 
Intel Xeon SP Gen 3 – ICE LAKE
Intel Xeon SP Gen 3 – ICE LAKE
Module type (No mixing in a server)
Module type (No mixing in a server)
1 DIMM per channel 1 DPC
2 DIMMs per channel 2 DPC
Registered DIMM (RDIMM, 3DS)
Registered DIMM (RDIMM, 3DS)
3200
2933
Load Reduced DIMM (LRDIMM, 3DS)
Load Reduced DIMM (LRDIMM, 3DS)
3200
2933
 
Module type (No mixing in a server)
Registered DIMM (RDIMM, 3DS)
Load Reduced DIMM (LRDIMM, 3DS)
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