eMCP Components - Embedded Multi-Chip Package for device manufacturers
Kingston offers a wide range of JEDEC standard eMCP components. eMCP integrates eMMC and low-power DRAM into a package with one small footprint. This solution simplifies system PCB design and speeds time to market. eMCP is an ideal combined storage and memory component for space-constrained systems such as smartphones, tablets, wearables and various IoT devices.
eMCP Part Numbers and Specifications
| LPDDR3 eMCP P/Ns | LPDDR3 eMCP Capacity | Speed Mode | e•MMC version | Package Size |
|---|---|---|---|---|
| 04EMCP04-NL3DM627 | 4GB eMMC + 4Gb LPDDR3 | HS400 | 5.0 | 11.5 x 13 x 1.0 (221 Ball) |
| 08EMCP04-NL3DT227 | 8GB eMMC + 4Gb LPDDR3 | HS400 | 5.0 | 11.5 x 13 x 1.0 (221 Ball) |
| 08EMCP08-NL3DT227 | 8GB eMMC + 8Gb LPDDR3 | HS400 | 5.0 | 11.5 x 13 x 1.0 (221 Ball) |
| 16EMCP08-NL3DTB28 | 16GB eMMC + 8Gb LPDDR3 | HS400 | 5.1 | 11.5 x 13 x 1.0 (221 Ball) |
| 16EMCP16-EL3GTB29 | 16GB eMMC + 16Gb LPDDR3 | HS400 | 5.1 | 11.5 x 13 x 1.0 (221 Ball) |
| 16EMCP16-ML4ATB29 | 16GB eMMC + 16Gb LPDDR4x | HS400 | 5.1 | 11.5x13x1.0 (254 Ball) |
| 32EMCP16-EL3GTB29 | 32GB eMMC + 16Gb LPDDR3 | HS400 | 5.1 | 11.5 x 13 x 1.0 (221 Ball) |
| 32EMCP16-ML4ATB29 | 32GB eMMC + 16Gb LPDDR4x | HS400 | 5.1 | 11.5x13x1.0 (254 Ball) |
| 32EMCP24-EL3JTB29 | 32GB eMMC + 24Gb LPDDR3 | HS400 | 5.1 | 11.5 x 13 x 1.0 (221 Ball) |
| 32EMCP32-ML4BTB29 | 32GB eMMC + 32Gb LPDDR4x | HS400 | 5.1 | 11.5x13x1.0 (254 Ball) |
| 64EMCP24-EL3JTA29 | 64GB eMMC + 24Gb LPDDR3 | HS400 | 5.1 | 11.5 x 13 x 1.0 (221 Ball) |
| 64EMCP32-EL3HTA29 | 64GB eMMC + 32Gb LPDDR3 | HS400 | 5.1 | 11.5 x 13 x 1.1 (221 Ball) |
| 64EMCP32-ML4BTA29 | 64GB eMMC + 32Gb LPDDR4x | HS400 | 5.1 | 11.5x13x1.0 (254 Ball) |