eMCP – the perfect power efficient integrated storage solution for space-constrained mobile, IoT, and embedded applications
Kingston offers a range of JEDEC standard eMCP components. eMCP integrates Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Multi-Chip Package (MCP) with one small footprint. This solution provides greater integration, reducing overall size. eMCP is an ideal combined storage and memory component for space-constrained systems such as smartphones, tablets, wearables, and various “Internet of Things” (IoT) devices.
eMCP Part Numbers and Specifications
LPDDR3 based eMCP
| Part Number | Capacity | Standard | Package | FBGA | Operating Temperature | ||
|---|---|---|---|---|---|---|---|
| NAND (GB) | DRAM (Gb) | eMMC | DRAM | (mm) | |||
| 08EM08-N3GMV36 | 8 | 8 | 5.1 | LPDDR3 | 11.5x13.0x1.0 | 221 | -25°C ~ +85°C |
| 16EM16-N3GMW8E | 16 | 16 | 5.1 | LPDDR3 | 11.5x13.0x1.0 | 221 | -25°C ~ +85°C |
LPDDR4x based eMCP
| Part Number | Capacity | Standard | Package | FBGA | Operating Temperature | ||
|---|---|---|---|---|---|---|---|
| NAND (GB) | DRAM (Gb) | eMMC | DRAM | (mm) | |||
| 32EM16-M4JTQ0A | 32 | 16 | 5.1 | LPDDR4x | 11.5x13.0x1.0 | 254 | -25°C ~ +85°C |
| 32EM32-M4KTQ0A | 32 | 32 | 5.1 | LPDDR4x | 11.5x13.0x1.0 | 254 | -25°C ~ +85°C |
| 64EM32-M4GTY9B | 64 | 32 | 5.1 | LPDDR4x | 11.5x13.0x1.0 | 254 | -25°C ~ +85°C |
| 128EM32-M4GTY9B | 128 | 32 | 5.1 | LPDDR4x | 11.5x13.0x1.0 | 254 | -25°C ~ +85°C |
| 128EM64-M4HTY9B | 128 | 64 | 5.1 | LPDDR4x | 11.5x13.0x1.1 | 254 | -25°C ~ +85°C |
